Wafer Products

• SCHOTT 3.3mm thickness 8-inch wafer, semiconductor chip grinding substrate
• Fused silica glass quartz crystal 4-12 inches 0.5mm, 0.7mm, 1.1mm, etc. double-sided polishing <10um
• Glass wafer4 inch, 6 inch, 8 inch, 12 inch，Semiconductor packaging grade glass wafer
• Glass wafers for semiconductor packaging 0.1mm thickness wafer 4 inch, 6 inch, 8 inch
• Quartz wafer, Asahi Glass 0.05MM glass, SCHOTT, Asahi Glass, Corning GG6
• 4-12 inch glass wafer
• Borosilicate glass wafer 4 inch, 6 inch, 8 inch, 12 inch, customizable size and thickness
• Glass wafer，Semiconductor packaging grade glass wafer
• 2"4"6"8"12" glass wafer High purity quartz wafer JGS1 for etching and bonding
• 0.2mm thick sapphire double throw (0.15mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 1.0）