Wafer Products
- SCHOTT 3.3mm thickness 8-inch wafer, semiconductor chip grinding substrate
- Fused silica glass quartz crystal 4-12 inches 0.5mm, 0.7mm, 1.1mm, etc. double-sided polishing <10um
- Glass wafer4 inch, 6 inch, 8 inch, 12 inch,Semiconductor packaging grade glass wafer
- Glass wafers for semiconductor packaging 0.1mm thickness wafer 4 inch, 6 inch, 8 inch
- Quartz wafer, Asahi Glass 0.05MM glass, SCHOTT, Asahi Glass, Corning GG6
- 4-12 inch glass wafer
- Borosilicate glass wafer 4 inch, 6 inch, 8 inch, 12 inch, customizable size and thickness
- Glass wafer,Semiconductor packaging grade glass wafer
- 2"4"6"8"12" glass wafer High purity quartz wafer JGS1 for etching and bonding
- 0.2mm thick sapphire double throw (0.15mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 1.0)