2-12 inch glass wafer (0.15mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 1.0)

Product Description


Diameter 2" 3" 4" 5" 6" 8"
Thickness (um) Depends on Request
Material Fused Silica
Grade/Brand JGS2/JGS1/JGS3
Surface Finished DSP/SSP
TTV (um) <8 <10 <10 <10 <15 <20
Bow/Warp (um) <30 <30 <40 <40 <60 <60
Ra (nm) <1
S/D (um) 40/20
Fused Silica
Mechanical Units of Measure SI/Metric (Imperial)
Density gm/cc (lb/ft3) 2.2 -137.4
Porosity % (%) 0 0
Color clear
Flexural Strength MPa (lb/in2x103)
Elastic Modulus GPa (lb/in2x106) 73 -10.6
Shear Modulus GPa (lb/in2x106) 31 -4.5
Bulk Modulus GPa (lb/in2x106) 41 -6
Poisson’s Ratio 0.17 -0.17
Compressive Strength MPa (lb/in2x103) 1108 -160.7
Hardness Kg/mm2 600
Fracture Toughness KIC MPa•m1/2
Maximum Use Temperature (no load) °C (°F) 1100 -2000




Thermal


Thermal Conductivity W/m•°K (BTU•in/ft2•hr•°F) 1.38 -9.6
Coefficient of Thermal Expansion 10–6/°C (10–6/°F) 0.55 -0.31
Specific Heat J/Kg•°K (Btu/lb•°F) 740 -0.18
Electrical


Dielectric Strength ac-kv/mm (volts/mil) 30 -750
Dielectric Constant @ 1 MHz 3.82 -3.82
Dissipation Factor @ 1 MHz 0.00002 -0.00002
Loss Tangent @ 1 MHz
Volume Resistivity ohm•cm >1010


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